Quick Turn Rigid

Basic Info.

Model NO.	FLCA-Q009
Processing Technology	Electrolytic Foil
Base Material	Polyimide
Insulation Materials	Epoxy Resin
Surface Finishing	Enig
Silkscreen	White
Shipping Type	DHL.TNT, EMS, FedEx, UPS etc
PCB Design	Custom Design Product
Lead Time	4-5 Working Days
Board Thickness	0.1 mm
Solser Mask	Yellow
Copper Thickness	1 Oz
Board Layer	2
Board Material	Polyimide
Transport Package	Vacuum +Carton Packing
Specification	RoHS, ISO9001, UL, SGS
Trademark	FL
Origin	Shenzhen, China
HS Code	8534009000
Production Capacity	20000square Meter/Mon

Product Description

Quick Turn Rigid-Flex Board Manufacturing

Dear buyer,

Thank you for scanning our website about FPC.As is known,PCB is customized product ,so the unit price is not real,details please contact me and a quotation will be offered.Please send us PCB files in gerber files, ".pcbdoc", ".lay", ".lay6" or ".brd" .

Product Description

Standard Flex Materials:

Polyimide (Kapton) : 0.5 mil to 5 mils (.012mm - .127mm) Adhesiveless Copper Clad Base Material : 1 mil to 5 mils Flame Retardant Laminate, Base Material, and Coverlay High Performance Epoxy Laminate and Prepreg High Performance Polyimide Laminate and Prepreg UL and RoHS Compliant Material on request High Tg FR4 (170+ Tg), Polyimide (260+ Tg)

Base Copper: 1/3 oz. - .00047 in. (.012mm)--rarely used 1/2 oz. - .0007 in. (.018mm) 1 oz. - .0014 in. (.036mm) 2 oz. - .0028 in. (.071mm)

Solder Mask: Polyimide Coverlay: 0.5 mil to 5 mils Kapton (.012mm - .127mm) with 0.5 to 2 mil Adhesive (.012mm - .051mm) LPI and LDI Flexible Soldermasks

Flex PCB Capability

Fastline Circuits Co., Limited
FPC Technology and Capabilities
Material	FR4,Polyimide / Polyester
Counts	Flex: 1~8L; Rigid-Flex: 2~8L
Board Thickness	Min.0.05mm ; Max. 0.3mm
Copper Thickness	1/3 oz --- 2 oz
CNC Drill Size (Max)	6.5mm
CNC Drill Size (Min)	Flex: 0.15mm
Holes Location Tolerance	±0.05mm
Coverlay Drill Size (Min)	0.6mm
Hole to Coverlay Opening Windows (Min)	0.15mm
Min Line Width / Spacing	0.1/0.1mm
Copper Thickness on Hole Wall	Flex:12-22μm
Min Pad Size	φ0.2mm
Etch Tolerance	Finished line width tolerance ±20%
Pattern Registration Tolerance	±0.1mm (Working Panel Size: 250*300mm)
Coverlay Registration Tolerance	±0.15mm
Solder Mask Registration Tolerance	±0.2mm
Solder Mask to PAD	Non photosensitive: 0.2mm
Solder Mask to PAD	Photosensitive: 0.1mm
Min. Solder Mask Dam	0.1mm
Misregistration Tolerance	±0.30mm
for Stiffener, Adhesive, Glue paper	±0.30mm
Surface Finish	Plating Ni / Au ; Chemical Ni / Au ; OSP